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RF Technique for Detection of Printed Circuit Wiring Imperfections

IP.com Disclosure Number: IPCOM000046259D
Original Publication Date: 1983-Jun-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Henderson, MA: AUTHOR

Abstract

In multilayer circuit boards, imperfections 10 in the printed circuit wiring could reduce the inter-level separation distance to a point where copper migration can cause a short.

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RF Technique for Detection of Printed Circuit Wiring Imperfections

In multilayer circuit boards, imperfections 10 in the printed circuit wiring could reduce the inter-level separation distance to a point where copper migration can cause a short.

An RF signal traveling along a wave guide that encounters a physical open whose length is 1/4 wavelength does not see an open, but, instead, sees a continuous path. The separation distance between conductors 10 and 14 and the signal frequency are the controlling parameters. By using a variable frequency RF signal source the physical size of an opening can be measured. The frequency range involved is applied to one level 12 within a board by the RF signal source. A frequency monitor is to be attached to another level 14 within the board to which a short could occur. If an RF short is present at any of the frequencies generated by the RF signal source, the signal will be transferred to the second level 14 and will be measured by the frequency monitor. The frequency that is transferred would indicate the physical dimensions of the imperfection.

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