Browse Prior Art Database

Coating Prepreg During Electroless Plating

IP.com Disclosure Number: IPCOM000046376D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Matolka, W: AUTHOR

Abstract

In the manufacture of printed circuit boards utilizing the electroless plating technology, it is necessary to immerse the prepreg in an electroless plating bath. The glass fibers in the prepreg are sometimes close to the surface of the circuit board, and this results in "measling" (or spotting). It has been found that such damage to the surface of the circuit board can be eliminated by covering the circuit board with a polymeric film prior to the time that the circuit board is immersed in the electroless plating bath.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Coating Prepreg During Electroless Plating

In the manufacture of printed circuit boards utilizing the electroless plating technology, it is necessary to immerse the prepreg in an electroless plating bath. The glass fibers in the prepreg are sometimes close to the surface of the circuit board, and this results in "measling" (or spotting). It has been found that such damage to the surface of the circuit board can be eliminated by covering the circuit board with a polymeric film prior to the time that the circuit board is immersed in the electroless plating bath.

This film can either remain as a permanent part of the circuit board or it can be removed after the plating has been completed.

1