Browse Prior Art Database

Encapsulated Wire Circuit Board

IP.com Disclosure Number: IPCOM000046378D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Varker, KJ: AUTHOR

Abstract

Circuit boards can be fabricated by laying insulated wires in a layer of adhesive material. Such circuit boards are generally termed encapsulated wire circuit boards.

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Encapsulated Wire Circuit Board

Circuit boards can be fabricated by laying insulated wires in a layer of adhesive material. Such circuit boards are generally termed encapsulated wire circuit boards.

Such boards sometimes require components to be soldered on the surface of the board. A larger area for soldering components to the surface of such boards can be obtained by soldering "nails" into the holes in such boards and using the head of the nail as a surface on which other components can be soldered.

Engineering changes can be made in such boards by determining the exact location of the wire in the board by techniques such as X-ray and then utilizing a fine drill to cut the wire at a predetermined location.

If such a board is made in a multilayer configuration, engineering changes can be made in the board by covering the outside surface with a layer of adhesive and then using conventional encapsulated wire circuit board technology to affix wires to this external layer of adhesive.

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