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Browse Prior Art Database

Optimization of Wiring Characteristics

IP.com Disclosure Number: IPCOM000046379D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Smith, JE: AUTHOR

Abstract

It is known that circuit boards can be fabricated by bonding wires to a substrate. As such circuit boards are conventionally fabricated, all of the wires on the circuit board are made from the same type of copper.

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Optimization of Wiring Characteristics

It is known that circuit boards can be fabricated by bonding wires to a substrate. As such circuit boards are conventionally fabricated, all of the wires on the circuit board are made from the same type of copper.

Improved performance of the wiring apparatus used to fabricate such boards can be achieved by using a plurality of different types of wire depending upon the length of the particular wire. The material in various wires would be chosen so that the resistance of any particular connection does not exceed a specified maxiumum. The longer wires could consist of softer higher conductivity copper, whereas the shorter wires which are put in place last would use harder copper. This combination of types of copper will reduce wire breakage.

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