Browse Prior Art Database

Drilling in Peel-A-Part Copper

IP.com Disclosure Number: IPCOM000046380D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hunsinger, LE: AUTHOR [+2]

Abstract

Peel-a-part copper consists of a thin layer of copper supported by a relatively thick layer of copper which serves as a carrier. Peel-a- part copper is regularly used in the fabrication of printed circuit cores.

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Drilling in Peel-A-Part Copper

Peel-a-part copper consists of a thin layer of copper supported by a relatively thick layer of copper which serves as a carrier. Peel-a- part copper is regularly used in the fabrication of printed circuit cores.

When fabricating cores utilizing peel-a-part copper, it is necessary to drill through the panel in order to make plated through holes. If the holes are drilled prior to the removal of the carrier layer, the dimensional changes in the panel, while removing the carrier, also change the hole locations. In order to get accurate registration, one must take this change in dimension into account.

If the carrier layer is removed prior to the time that the holes are drilled, the change in dimension due to the removal of the carrier layer does not affect the location of the holes. The following sequence can therefore be used advantageously. First, laminate the composite peel-a-part onto a substrate; next, remove the carrier layer and protect with a film such as exposed photoresist; and finally, drill the holes through the thin layer of copper and the substrate.

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