Browse Prior Art Database

Gang Flux Dispenser

IP.com Disclosure Number: IPCOM000046388D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Chirico, C: AUTHOR [+3]

Abstract

The apparatus illustrated in Fig. l is a gang flux dispenser which can be utilized to deposit on demand droplets of flux onto chip-site sur faces located on a semiconductor substrate. The arrangement consists of a metering device to meter out solder flux or any other fluids by utilizing a piezoelectric cylinder pump 5 which, when an electric field is applied, contracts and forces out one drop of liquid. The amount of solder flux that leaves the cylinder pump assembly 5 is regulated by the number of applied electric pulses (one drop per pulse) and by the size of the orifice. The piezoelectric pumps are used in various ink jet printers. The apparatus illustrated in Figs. l and 2 consists of a dispenser housing 2 with flux container 3 (Fig. 3) and cover 4. The container is filled with solder flux.

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Gang Flux Dispenser

The apparatus illustrated in Fig. l is a gang flux dispenser which can be utilized to deposit on demand droplets of flux onto chip-site sur faces located on a semiconductor substrate. The arrangement consists of a metering device to meter out solder flux or any other fluids by utilizing a piezoelectric cylinder pump 5 which, when an electric field is applied, contracts and forces out one drop of liquid. The amount of solder flux that leaves the cylinder pump assembly 5 is regulated by the number of applied electric pulses (one drop per pulse) and by the size of the orifice. The piezoelectric pumps are used in various ink jet printers. The apparatus illustrated in Figs. l and 2 consists of a dispenser housing 2 with flux container 3 (Fig. 3) and cover 4. The container is filled with solder flux. Mounted on the inside dispenser housing are nine piezoelectric pump assemblies 5 which are connected to a pulse generator and preset counter (Fig. 3).

The substrate assembly 6 is transported on a conveyor, oriented and indexed into a fixed position (not shown), registered and coated with solder flux, then moved out from under the piezoelectric pump arrangement 5. The gang flux dispenser system l is ready to receive a new substrate assembly.

This system provides a metered control of flux droplets deposited onto the chip site, and faster and more effective operation.

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