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Conductance-Limited Gate Valve in Load-Lock System

IP.com Disclosure Number: IPCOM000046391D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Brancke, JS: AUTHOR [+4]

Abstract

This article concerns a conductance-limited gate valve for use in isolating the source chamber from the product chamber in a load-lock vacuum system. The valve features means for controlling the turbulence which can occur when the vacuum system is rough pumped. Additionally, the valve features means for protecting product wafers against contamination.

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Conductance-Limited Gate Valve in Load-Lock System

This article concerns a conductance-limited gate valve for use in isolating the source chamber from the product chamber in a load-lock vacuum system. The valve features means for controlling the turbulence which can occur when the vacuum system is rough pumped. Additionally, the valve features means for protecting product wafers against contamination.

In a load-lock vacuum system, when product wafers are unloaded from the product chamber, the chamber is exposed to atmosphere while the source chamber area is kept under high vacuum. After wafers have been loaded into the product chamber, the product chamber is pumped down to approximately l m before it is open to the source chamber. In accordance with this article, pumping is accomplished through an isolation valve body assembly. The use of the valve assembly eliminates turbulence in the product chamber, hence reducing contamination on the product wafers. After completion of pumping, the isolation valve paddle retracts, allowing communication between the two chambers. A conductance cover on top of the isolation valve paddle acts as the soft roughing orifice and also serves to protect against wafer breakage.

A conductance-limited gate valve 10, in accordance with this article, is shown in the figures. As shown in Fig. 1, value 10 isolates the source chamber 12 from the rate thickness monitor chamber 14 and the product chamber 18. When wafers 16 are first loaded into product chamb...