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IR Inspection to Detect Handling Damage

IP.com Disclosure Number: IPCOM000046402D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Hornung, A: AUTHOR [+3]

Abstract

Infrared (IR) transmission inspection of diced, coated monitor chips, intermingled with product chips, is used to infer product chip handling damage.

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IR Inspection to Detect Handling Damage

Infrared (IR) transmission inspection of diced, coated monitor chips, intermingled with product chips, is used to infer product chip handling damage.

The monitor chips are silicon substrates coated with appropriate thicknesses of Al and SiO2, like the product chips which they represent. The thicknesses of the coatings can be varied to obtain the desired sensitivity to impact and handling damage of the product chips. The SiO2 coating is optional as monitors without the SiO2 coating have been found to be adequate also.

Aluminum is damaged very easily by impact during handling of the intermingled monitor and product chips. Since aluminum is not transparent to IR while silicon is transparent, damage to the aluminum on the monitor chips can be detected very quickly and efficiently by IR inspection of the monitor chips in the transmission mode, as shown in the figure. The bright spots (corresponding to damaged aluminum) are counted to characterize the amount of aluminum damage suffered by the product chip lot represented by the monitor chips.

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