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Method of Improving the Adhesion of Copper on a Plastic Laminate

IP.com Disclosure Number: IPCOM000046422D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 59K

Publishing Venue

IBM

Related People

Bohlen, H: AUTHOR [+4]

Abstract

The surface of an epoxy resin glass fiber laminate is roughened by reactive ion etching through a photoresist mask with masking particles.

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Method of Improving the Adhesion of Copper on a Plastic Laminate

The surface of an epoxy resin glass fiber laminate is roughened by reactive ion etching through a photoresist mask with masking particles.

Reactive ion etching of the epoxy resin l (Fig. l) is effected in an oxygen plasma. The surface roughness is determined by the masking particles 3 contained in an organic layer 2 on the epoxy resin surface. Masking particles 3 may also be directly contained in epoxy resin l. They must have a low etch rate in oxygen plasma and be uniformly dispersed because of their small size of l to 3 mm.

For implementing the method according to Fig. 2, masking particles of metals, such as copper, or oxides, such as SiO2 or Al2O3, were used. Etching was effected in accordance with the following parameters: Gas: O2 Pressure: 43.2 mbar

Flow rate: 30 cm3/min.

Energy density: 0.2 Watt/cm2

Etch time: about 20 to 30 min.

Under these conditions, photoresist columns, tapered towards the bottom, with diameters O the particle diameter _ are obtained. After reactive ion etching, the photoresist layer is stripped in a wet chemical process.

Depending upon the size and distribution of the masking particles, the above- described method permits generating an arbitrary surface roughness in the epoxy resin. After roughening, a copper layer with very good adhesion characteristics is sputtered on to the epoxy resin.

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