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Method of Improving the Adhesion of Copper on a Plastic Laminate

IP.com Disclosure Number: IPCOM000046423D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 55K

Publishing Venue

IBM

Related People

Greschner, J: AUTHOR [+3]

Abstract

The surface of an epoxy resin glass fiber laminate is roughened by reactive ion etching in oxygen, using a film of metallic lands as an etch mask.

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Method of Improving the Adhesion of Copper on a Plastic Laminate

The surface of an epoxy resin glass fiber laminate is roughened by reactive ion etching in oxygen, using a film of metallic lands as an etch mask.

Reactive ion etching of the epoxy resin in oxygen plasma is effected through a film of metallic lands. The films 2 (Fig. 1), with a mean diameter of the metallic lands of about 1 to 3 mm can be readily generated by vapor depositing metals with a low melting point, such as tin or lead, on the epoxy resin substrate l.

For implementing the method according to Fig. 2, tin lands were used. The etch process was effected using the following parameters: Gas: O2 Pressure: 43.2 mbar

Flow rate: 30 cm3/min.

Energy density: 0.2 Watt/cm2

Etch time: about 20 to 30 min.

Under these conditions, epoxy columns l (Fig. 2), tapered towards the bottom, with diameters of 0.5 to 2.5 mm and a height of about 3 to 5 mm are obtained. The metal lands 2 are stripped after reactive ion etching in an etch bath.

After epoxy substrate l (Fig. 3) has been roughened, it is provided with a copper film 3 by sputtering or electroplating. As a result of being embedded between the epoxy resin columns tapered towards the bottom, the copper adheres excellently to the epoxy resin substrate.

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