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Method of Improving the Adhesion of Metal Films on Substrate Surfaces

IP.com Disclosure Number: IPCOM000046425D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Kaus, G: AUTHOR [+4]

Abstract

The surface of an epoxy resin glass fiber substrate is roughened by preferential sputtering, i.e., by an etch process in which individual components on the substrate are removed at different rates. Subsequently, a copper metallization is deposited on the roughened substrate surface.

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Method of Improving the Adhesion of Metal Films on Substrate Surfaces

The surface of an epoxy resin glass fiber substrate is roughened by preferential sputtering, i.e., by an etch process in which individual components on the substrate are removed at different rates. Subsequently, a copper metallization is deposited on the roughened substrate surface.

Copper islands with a thickness of about 2 to 5 nm are sputtered on to the surface of an epoxy resin substrate. Alternatively, it is possible to vapor deposit about a 20 nm thick copper alloy layer with aluminum or silicon on the substrate, thus forming a closed layer.

The layers, thus deposited, are etched in a dry etch process (ion milling, plasma etching, reactive ion etching), with the individual components being removed at different rates by preferential sputtering and the substrate being roughened.

The use of a thin copper island is advantageous for further processing, as it eliminates a wet process for the subsequent removal of material. When an alloy is used, aluminum and silicon are removed more rapidly than copper which can remain on the substrate without any adverse effect. Deposition of the adhesion- promoting metal, dry etching for roughening the substrate material, and deposition of the copper metallization can be advantageously effected one after the other in one reactor. N 0

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