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Method of Improving the Adhesion of Copper on a Plastic Laminate

IP.com Disclosure Number: IPCOM000046426D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 66K

Publishing Venue

IBM

Related People

Greschner, J: AUTHOR [+3]

Abstract

The surface of an epoxy resin glass laminate is roughened by reactive ion etching through a previously roughened photoresist layer acting as a mask after vapor deposition by oblique incidence.

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Method of Improving the Adhesion of Copper on a Plastic Laminate

The surface of an epoxy resin glass laminate is roughened by reactive ion etching through a previously roughened photoresist layer acting as a mask after vapor deposition by oblique incidence.

The surface of an epoxy resin substrate 1 (Fig. 1) is coated with a photoresist layer 2 with a thickness of about 1 to 4 mm. The photoresist layer is cured at a temperature which is less than that needed for completely evaporating the solvent. The photoresist thus treated, which still contains solvents, is roughened by reactive ion etching, with the substrates in the reactor resting on the cathode of a diode system.

The etch parameters are as follows: Gas: CF4

Pressure: 39.9 mbar

Flow rate: 30 cm3/min.

Energy density: 0.2 Watt/cm2

Etch time: about l5 to 30 min.

The roughness thus existing in photoresist 2, which is transferred to the substrate material, can be considerably increased by a process in which a thin masking layer 3 is deposited by oblique incidence on photoresist 2. As a masking material, metals, such as copper, or oxides, such as SiO2, can be used. Deposition by oblique incidence leads to the roughened photoresist 2 being partially masked, so that, owing to the extremely low etch rate of the masking material, the epoxy resin substrate l may be etched down to an arbitrary depth (Fig. 2) in the non-masked areas. The etch parameters for transferring the roughness of the photoresist to the substrate m...