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Mechanical Stress Reduction in VLSI Chip Cooling Assemblies

IP.com Disclosure Number: IPCOM000046435D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Gruber, H: AUTHOR [+4]

Abstract

The mechanical stress on a VLSI chip, which is caused by heat transferring material, such as grease or soft solder, indium, etc., in the gap between heat sink l and the VLSI chip (not shown), is to be reduced by a perforation of the heat sink surface contacting the chip surface. This perforation can be a pattern of holes 4 or a wire screen.

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Mechanical Stress Reduction in VLSI Chip Cooling Assemblies

The mechanical stress on a VLSI chip, which is caused by heat transferring material, such as grease or soft solder, indium, etc., in the gap between heat sink l and the VLSI chip (not shown), is to be reduced by a perforation of the heat sink surface contacting the chip surface. This perforation can be a pattern of holes 4 or a wire screen.

The dimensions of the perforation must be chosen in such a manner that the residual mechanical stress on the chip is sufficiently small to avoid chip damage. The heat-transferring material, entering holes 4, may even enter chambers 3 provided to accommodate excessive heattransferring material. Air escape holes 5 are connected to chambers 3, so that the air is not trapped inside holes 4.

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