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Browse Prior Art Database

Fluid Assembly for High Speed Chip Cooling

IP.com Disclosure Number: IPCOM000046507D
Original Publication Date: 1983-Jul-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Eldridge, JM: AUTHOR [+2]

Abstract

This semiconductor device assembly is cooled by bonding a grooved (110) cooling chip to an active IC chip and by providing the inlet and outlet fluid ports on the opposite side of the chip, sealed to a fluid supply system built into the laminated semiconductor assembly itself.

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Fluid Assembly for High Speed Chip Cooling

This semiconductor device assembly is cooled by bonding a grooved (110) cooling chip to an active IC chip and by providing the inlet and outlet fluid ports on the opposite side of the chip, sealed to a fluid supply system built into the laminated semiconductor assembly itself.

The structure is shown in the figure as comprising two silicon chips: an etched (110) silicon chip 10 is eutectically bonded to the bottom of a circuit chip 12 which also contains two or more etched supply inlet and outlet holes 14, 16. The holes can be ultrasonically machined, anisotropically etched, or laser etched in the circuit chip after the circuits are completed. Corresponding holes 24, 26 are located in the multilayer circuit (MLC) substrate 28, as indicated in the figure. These holes can be made during the processing of the MLC sheets at the same time as the electric conductor viaducts. During the normal deposition of solder balls 30, the holes in the circuit chip are also surrounded by the Pb-Sn alloy.

In this way, the holes in the top of the completed MLC substrate are sealed to the holes etched in the circuit chip at the same time the final bonds are formed. The ring of Pb-Sn alloy serves as a fluid-tight gasket. Electric conductor(s), for example, 32, are used for connecting circuitry on the chip 12 through the solder ball(s) to electric circuit pin(s) 34.

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