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Ceramic Substrate Grinding Process

IP.com Disclosure Number: IPCOM000046611D
Original Publication Date: 1983-Aug-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Rifkin, AA: AUTHOR [+2]

Abstract

Good profile grinding of ceramic substrates at high machining rates and with a minimum of tool wear and ceramic stress is achieved by grinding while submersed in a liquid coolant. As shown in the figure, mounting plate 1 is secured to the milling machine bed. A tank arrangement 2 is sealed to plate 1 so as to permit reception of a liquid coolant. A shallow jig borer vise 3 is positioned within the tank and arranged to accommodate ceramic substrate 5 upon which grinding is to be carried out. Drain 4 is utilized for recirculating filtered liquid coolant. The grinding tool (not shown) may be a cup wheel of 3 to 4 inches in diameter rotated about the milling axis, as shown in the figure.

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Ceramic Substrate Grinding Process

Good profile grinding of ceramic substrates at high machining rates and with a minimum of tool wear and ceramic stress is achieved by grinding while submersed in a liquid coolant. As shown in the figure, mounting plate 1 is secured to the milling machine bed. A tank arrangement 2 is sealed to plate 1 so as to permit reception of a liquid coolant. A shallow jig borer vise 3 is positioned within the tank and arranged to accommodate ceramic substrate 5 upon which grinding is to be carried out. Drain 4 is utilized for recirculating filtered liquid coolant. The grinding tool (not shown) may be a cup wheel of 3 to 4 inches in diameter rotated about the milling axis, as shown in the figure.

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