Browse Prior Art Database

Thin-Film Solid-State Battery Incorporated Within Electronic Package

IP.com Disclosure Number: IPCOM000046614D
Original Publication Date: 1983-Aug-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 20K

Publishing Venue

IBM

Related People

Shaw, RR: AUTHOR

Abstract

Vacuum-deposited cells and batteries, as shown, can be made thin enough (N10 mm) to be compatible with component dimensions of electronic packages. Li or Li-alloy anodes have the advantages of high voltage and high energy density, when coupled with many solid cathodes (TiS2, MnO2, V2O5, etc.). The electrolyte can be any of a number of Li salts or glasses. The shelf or storage life is very long (approximately 20 years). These cells when incorporated within the structure or packaging or devices could serve several functions: constant power or reference voltage; gate signalling by pulsing when coupled to capacitors; direct powering of CMOS circuitry in portable security cards/passcards/credit cards/ID cards; and self-destruct mechanisms in military circuitry.

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Thin-Film Solid-State Battery Incorporated Within Electronic Package

Vacuum-deposited cells and batteries, as shown, can be made thin enough (N10 mm) to be compatible with component dimensions of electronic packages. Li or Li-alloy anodes have the advantages of high voltage and high energy density, when coupled with many solid cathodes (TiS2, MnO2, V2O5, etc.). The electrolyte can be any of a number of Li salts or glasses. The shelf or storage life is very long (approximately 20 years). These cells when incorporated within the structure or packaging or devices could serve several functions: constant power or reference voltage; gate signalling by pulsing when coupled to capacitors; direct powering of CMOS circuitry in portable security cards/passcards/credit cards/ID cards; and self-destruct mechanisms in military circuitry. Also, when these cells are incorporated on-board with semiconductor packages, they form a self-contained power source with the possible need of fewer power leads. The design and fabrication of these cells can be made compatible with circuit geometries and fabrication techniques.

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