Browse Prior Art Database

High Via Density Multilayer Module

IP.com Disclosure Number: IPCOM000046615D
Original Publication Date: 1983-Aug-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Stoller, HI: AUTHOR

Abstract

The effective number of vias accommodated in a given area of a multilayered ceramic module is increased by locating the wiring vias at the crossovers of the X-Y conductors of the respective adjacent plane pairs of the module, rather than at the previously used fixed interstitial via sites. The connecting vias are shown by the cross-hatched areas of Fig. 1 at the crossovers of the X and Y matrix conductors. In the corresponding elevation view of Fig. 2, it can be seen that the X and Y conductors are on adjacent planes constituting plane pairs. The vias extend only between the X and Y planes of a respective plain pair.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

High Via Density Multilayer Module

The effective number of vias accommodated in a given area of a multilayered ceramic module is increased by locating the wiring vias at the crossovers of the X-Y conductors of the respective adjacent plane pairs of the module, rather than at the previously used fixed interstitial via sites. The connecting vias are shown by the cross-hatched areas of Fig. 1 at the crossovers of the X and Y matrix conductors. In the corresponding elevation view of Fig. 2, it can be seen that the X and Y conductors are on adjacent planes constituting plane pairs. The vias extend only between the X and Y planes of a respective plain pair.

1

Page 2 of 2

2

[This page contains 3 pictures or other non-text objects]