Browse Prior Art Database

Cooling System for Semiconductor Modules

IP.com Disclosure Number: IPCOM000046844D
Original Publication Date: 1983-Aug-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Andres, H: AUTHOR [+3]

Abstract

A typical semiconductor module consists of a ceramic substrate 1 with pads 2 and conductors, to which semiconductor chips 4 are soldered by solder balls 5. This arrangement is encapsulated in a metal cap 6. The operating heat, produced in semiconductor chips 4, is dissipated by a heat conductor bridge to metal cap 6 from where it is removed, for example, by cooling ribs 7. To improve the heat dissipation rate, the heat is directly removed from chip 4 to cap 6. For this purpose, the rear sides of chips 4 are directly connected to the inside of cap 6, so that the thermal resistance between chip 4 and cap 6 is negligible. Through resilient pins or wires 3, solder balls 5 of chips 4 are connected to the pads on the surface of substrate 1.

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Cooling System for Semiconductor Modules

A typical semiconductor module consists of a ceramic substrate 1 with pads 2 and conductors, to which semiconductor chips 4 are soldered by solder balls 5. This arrangement is encapsulated in a metal cap 6. The operating heat, produced in semiconductor chips 4, is dissipated by a heat conductor bridge to metal cap 6 from where it is removed, for example, by cooling ribs 7. To improve the heat dissipation rate, the heat is directly removed from chip 4 to cap 6. For this purpose, the rear sides of chips 4 are directly connected to the inside of cap 6, so that the thermal resistance between chip 4 and cap 6 is negligible. Through resilient pins or wires 3, solder balls 5 of chips 4 are connected to the pads on the surface of substrate 1.

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