Browse Prior Art Database

Substrate Adhesion Measurement System

IP.com Disclosure Number: IPCOM000047025D
Original Publication Date: 1983-Sep-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Badami, DA: AUTHOR [+3]

Abstract

This article describes a system for measuring the adhesion parameters of a photoresist prior to its application on the wafers. A wafer is placed on an adhesion-measuring tool and a uniform drop of resist is pipetted on the wafer at a preselected height above an optical measuring system, such as, for example, a laser end-point detector (Fig. 1). A dynamic trace is recorded using this optical system and relative values of adhesion are obtained from the readings of characteristics of the flow rate and remaining thickness (Fig. 2). Absolute values for adhesion are obtained through a calibration table derived from image-lifting studies.

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Substrate Adhesion Measurement System

This article describes a system for measuring the adhesion parameters of a photoresist prior to its application on the wafers. A wafer is placed on an adhesion-measuring tool and a uniform drop of resist is pipetted on the wafer at a preselected height above an optical measuring system, such as, for example, a laser end-point detector (Fig. 1). A dynamic trace is recorded using this optical system and relative values of adhesion are obtained from the readings of characteristics of the flow rate and remaining thickness (Fig. 2).

Absolute values for adhesion are obtained through a calibration table derived from image-lifting studies.

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