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Improved PMMA Resist Films

IP.com Disclosure Number: IPCOM000047034D
Original Publication Date: 1983-Sep-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Cortellino, CA: AUTHOR

Abstract

Placing unexposed baked resist, such as PMMA (polymethyl methacrylate), which is dependent on differential solubility, in the resist developer before exposure, removes low molecular weight fractions, thereby minimizing pinhole formation, improving edge definition and minimizing image spread. For treating PMMA, place the film in a developer for one hour and then bake for one hour at 165ŒC (second bake). The unexposed film dissolving rate will be under 3 ˜/min. as compared to approximately 30 ˜/min. for untreated films.

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Improved PMMA Resist Films

Placing unexposed baked resist, such as PMMA (polymethyl methacrylate), which is dependent on differential solubility, in the resist developer before exposure, removes low molecular weight fractions, thereby minimizing pinhole formation, improving edge definition and minimizing image spread. For treating PMMA, place the film in a developer for one hour and then bake for one hour at 165OEC (second bake). The unexposed film dissolving rate will be under 3 ~/min. as compared to approximately 30 ~/min. for untreated films.

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