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Glass Redraw Method for Substrate Layer Manufacture

IP.com Disclosure Number: IPCOM000047035D
Original Publication Date: 1983-Sep-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 61K

Publishing Venue

IBM

Related People

Shaw, RR: AUTHOR

Abstract

Shown is a technique which can avoid problems with sintering control and hole punching of green sheets, encountered with MLC (multilayer ceramic) technology. Individual substrate layers can be made by a draw and redraw bundling operation using glass rods. Rods of different solubilities are assembled in the desired via pattern, as in Fig. 1, are then fused and drawn down to smaller dimensions, as in Fig. 2, and the step is repeated, as required, to the final size. The final billet is sliced (Fig. 4) into an appropriate substrate followed by an etch-out of the soluble glass to get a desired via pattern (Fig. 5). After metallization, the slices can be stacked and fused to other patterns to obtain a substrate package.

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Glass Redraw Method for Substrate Layer Manufacture

Shown is a technique which can avoid problems with sintering control and hole punching of green sheets, encountered with MLC (multilayer ceramic) technology. Individual substrate layers can be made by a draw and redraw bundling operation using glass rods. Rods of different solubilities are assembled in the desired via pattern, as in Fig. 1, are then fused and drawn down to smaller dimensions, as in Fig. 2, and the step is repeated, as required, to the final size. The final billet is sliced (Fig. 4) into an appropriate substrate followed by an etch- out of the soluble glass to get a desired via pattern (Fig. 5). After metallization, the slices can be stacked and fused to other patterns to obtain a substrate package.

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