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Groove Design for Quartz Boat to Process Semiconductor Wafers

IP.com Disclosure Number: IPCOM000047064D
Original Publication Date: 1983-Sep-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Deseez, C: AUTHOR [+2]

Abstract

Quartzware is widely used in hot semiconductor wafer processing such as in open diffusion tubes or low pressure chemical vapor deposition equipment. The holding rods of quartz boats are provided with grooves which receive the wafers and maintain them in the proper position during processing. A standard profile is shown in Fig. 1A. Angle a is about 60Œ. With this profile, microscope observations have evidenced many asperities at the surface of the groove. A rough surface creates serious potential risks for causing undesired damage to the wafers. Flakes or fragments of silicon removed from one place on the silicon wafer may remain on another place and be a source of contamination during subsequent processing steps. The profile shown in Fig. 1B drastically reduces these problems.

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Groove Design for Quartz Boat to Process Semiconductor Wafers

Quartzware is widely used in hot semiconductor wafer processing such as in open diffusion tubes or low pressure chemical vapor deposition equipment. The holding rods of quartz boats are provided with grooves which receive the wafers and maintain them in the proper position during processing. A standard profile is shown in Fig. 1A. Angle a is about 60OE. With this profile, microscope observations have evidenced many asperities at the surface of the groove. A rough surface creates serious potential risks for causing undesired damage to the wafers. Flakes or fragments of silicon removed from one place on the silicon wafer may remain on another place and be a source of contamination during subsequent processing steps. The profile shown in Fig. 1B drastically reduces these problems. It has been demonstrated that angle b is very critical when the following objectives or goals are sought. - The groove must be sufficiently open in order to facilitate wafer loading in the quartz boat with a minimum of contact and friction on the holding rods. - Also, the groove must be sufficiently open to allow complete thermal glassing of the internal walls and the bottom of the groove without causing any deformation or even a worse collapse of the groove geometry. - On the contrary, the opening of the groove must be sufficiently tight to prevent the wafers either from vibrating or coming into contact with one another, during...