Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Preparation of Black Polyimide Films

IP.com Disclosure Number: IPCOM000047256D
Original Publication Date: 1983-Oct-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Bargon, J: AUTHOR [+3]

Abstract

Carbon and similar additives have been mixed with polyamic acid solution to provide polyimide films with light-barrier properties. Smooth, thin polyimide films are not possible since the particulates are usually too large. During cyclization (cure) an uneven distribution of the additive in the bulk chemistry occurs, with the additive concentrating at the substrate interface. Adhesion is usually poor since the molecular weight of the polyamic acid is sharply reduced with addition of the additive. Extremely thin films of black polyimide, having excellent adhesion and total opacity, have now been prepared. The polyimide has excellent thermal properties having withstood thermal exposure in air at 500ŒC for thirty minutes. Two formulations of polyamic acid solution, when fully cured, produce black polyimide films.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 94% of the total text.

Page 1 of 1

Preparation of Black Polyimide Films

Carbon and similar additives have been mixed with polyamic acid solution to provide polyimide films with light-barrier properties.

Smooth, thin polyimide films are not possible since the particulates are usually too large. During cyclization (cure) an uneven distribution of the additive in the bulk chemistry occurs, with the additive concentrating at the substrate interface. Adhesion is usually poor since the molecular weight of the polyamic acid is sharply reduced with addition of the additive. Extremely thin films of black polyimide, having excellent adhesion and total opacity, have now been prepared. The polyimide has excellent thermal properties having withstood thermal exposure in air at 500OEC for thirty minutes.

Two formulations of polyamic acid solution, when fully cured, produce black polyimide films. Method IPMDA-TMB (Pyromellitic dianhydride and 3,3',5,5' Tetramethyl benzidine). Procedure of synthesis: Weigh stoichiometric amounts of each precursor and dissolve each, separately, in methyl ethyl ketone. Add the two solutions together and allow the entire and formed precipitate to settle. Filter the solid precipitate, then place the solids into solution using dimethyl formamide (DMF). This polyamic acid may now be spun onto a substrate and cured by known common procedure. Method II TFPA-ODA (Tetrafluorophthalic anhydride and 4,4' Oxydianaline). Procedure of synthesis: Weigh stoichiometric amounts of each precursor, an...