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Power and Ground Bus Structure on Integrated Circuit for Circuit Compression

IP.com Disclosure Number: IPCOM000047400D
Original Publication Date: 1983-Nov-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Caldwell, LB: AUTHOR [+4]

Abstract

A configuration of repeated "internal-rectangle" structures of opposite power and ground buses provides a compact configuration on an integrated circuit substrate. This is particularly valuable for technologies in which circuit systems (macros) are on the same level as the metal conductors. Fig. 1 shows a basic starting configuration having the power bus around the outside and the ground bus internal and defining two perpendicular lines, each one parallel to one of the outside power lines. The regions between the lines need not be symmetrical and will not be so where areas of different sizes are desirable to accommodate macros of different sizes or configurations. Fig. 2 shows a configuration like that of Fig. 1 with the larger regions having further internal rectangles.

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Power and Ground Bus Structure on Integrated Circuit for Circuit Compression

A configuration of repeated "internal-rectangle" structures of opposite power and ground buses provides a compact configuration on an integrated circuit substrate. This is particularly valuable for technologies in which circuit systems (macros) are on the same level as the metal conductors. Fig. 1 shows a basic starting configuration having the power bus around the outside and the ground bus internal and defining two perpendicular lines, each one parallel to one of the outside power lines. The regions between the lines need not be symmetrical and will not be so where areas of different sizes are desirable to accommodate macros of different sizes or configurations. Fig. 2 shows a configuration like that of Fig. 1 with the larger regions having further internal rectangles. Each added ground and power line is parallel to a power or ground line, respectively. As shown in Fig. 3, smaller and smaller internal rectangles can be provided by adding further lines perpendicular to the longer lines already present. Macros are located in those regions and connected to the buses by standard integrated circuit technology. This internal-rectangle configuration locates the buses close to the macros and thereby reduces space requirements for connections to the buses. The overall circuit system on a substrate is compressed in area. Because of the predominantly rectangular pattern of the circuit layout, bot...