Browse Prior Art Database

Micropin Interface Metallization Pretreatment

IP.com Disclosure Number: IPCOM000047495D
Original Publication Date: 1983-Nov-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Palmer, MJ: AUTHOR

Abstract

Treating platinum micropins with boiling aqua regia, to reduce crown heights, after machining, causes photoresist thinning at micropin tips so that after development processing the micropins are selectively exposed at their tips for subsequent interface metallization. Micropin processing procedures are followed through surface grinding on the platinum surface. At this point the platinum is electrodischarge machined and cleaned. The micropin assembly is subjected to a 7.5-minute immersion in boiling aqua regia to reduce crown heights after which pin joining procedures are followed. The pinned part is flooded with a positive photoresist, and given a low temperature bake and a blanket exposure which allows the resist that is naturally thinnest on the micropin tips to be developed away.

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Micropin Interface Metallization Pretreatment

Treating platinum micropins with boiling aqua regia, to reduce crown heights, after machining, causes photoresist thinning at micropin tips so that after development processing the micropins are selectively exposed at their tips for subsequent interface metallization. Micropin processing procedures are followed through surface grinding on the platinum surface. At this point the platinum is electrodischarge machined and cleaned. The micropin assembly is subjected to a 7.5-minute immersion in boiling aqua regia to reduce crown heights after which pin joining procedures are followed. The pinned part is flooded with a positive photoresist, and given a low temperature bake and a blanket exposure which allows the resist that is naturally thinnest on the micropin tips to be developed away. The part is loaded for interface metallization, sputter cleaned, and provided with a mercury wettable interface metallization. The part is then stripped of photoresist and mercurized.

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