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Flow Distributor for Plating Tank

IP.com Disclosure Number: IPCOM000047548D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 52K

Publishing Venue

IBM

Related People

Daley, LR: AUTHOR [+4]

Abstract

Tanks used for plating, such as those used to electrolessly plate copper onto printed circuit boards, are often relatively large. In order to get high quality plating it is essential that the fluid in such tanks be uniformly distributed and that the various chemicals which are added to the bath are adequately mixed prior to the time that the fluid comes in contact with the parts being plated. This is frequently accomplished by having a variety of distribution manifolds on the bottom of the plating tank. Often the holes in the manifolds have a graduated size distribution in order to compensate for the pressure differential in the distribution pipes. Added complexity is due to the fact that the plating reaction takes place both on the parts being plated and on the other elements in the tank, such as on the distribution manifolds.

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Flow Distributor for Plating Tank

Tanks used for plating, such as those used to electrolessly plate copper onto printed circuit boards, are often relatively large.

In order to get high quality plating it is essential that the fluid in such tanks be uniformly distributed and that the various chemicals which are added to the bath are adequately mixed prior to the time that the fluid comes in contact with the parts being plated. This is frequently accomplished by having a variety of distribution manifolds on the bottom of the plating tank. Often the holes in the manifolds have a graduated size distribution in order to compensate for the pressure differential in the distribution pipes. Added complexity is due to the fact that the plating reaction takes place both on the parts being plated and on the other elements in the tank, such as on the distribution manifolds. Since the holes in the distribution manifolds change size due to this plating, frequent cleaning is required. An improved distribution system can be achieved by placing a distribution chamber 10 on the bottom of the plating tank 5. The distribution chamber 10 is covered by a distribution plate 15 which has holes 27 therein. The fluid is supplied to the distribution chamber 10, and it flows through the distribution plate 15 into the plating chamber 20. The excess fluid flows over the weirs 30 and is returned to the distribution chamber by a passage way 35.

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