Browse Prior Art Database

Semiconductor Wafer Chuck-Closing Force Gauge

IP.com Disclosure Number: IPCOM000047585D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 70K

Publishing Venue

IBM

Related People

Messina, GP: AUTHOR [+2]

Abstract

An apparatus for accurately measuring the closing force for a wafer semiconductor centering chuck is disclosed. The closing force for centering a chuck on a photolithographic exposure machine should be maintained within the prescribed limits for the machine. If the force is too low, a wafer will not register properly on the wafer pedestal and pattern centrality will be affected. If the force is too high, there is a possibility of chipping or otherwise damaging the wafer. This disclosure describes a gauge for measuring the closing force of a chuck which is convenient to use, easy to adjust and which can measure the chuck closing force accurately. The gauge shown in Figs. 1 and 2, includes a thin metal disc 1 which is notched at approximately the same diameter as the wafer.

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Semiconductor Wafer Chuck-Closing Force Gauge

An apparatus for accurately measuring the closing force for a wafer semiconductor centering chuck is disclosed. The closing force for centering a chuck on a photolithographic exposure machine should be maintained within the prescribed limits for the machine. If the force is too low, a wafer will not register properly on the wafer pedestal and pattern centrality will be affected. If the force is too high, there is a possibility of chipping or otherwise damaging the wafer. This disclosure describes a gauge for measuring the closing force of a chuck which is convenient to use, easy to adjust and which can measure the chuck closing force accurately. The gauge shown in Figs. 1 and 2, includes a thin metal disc 1 which is notched at approximately the same diameter as the wafer. The disc 1 carries a sliding yoke 2 which is guided by two pins 3 and which is free to move within limits along the centerline through the notch pin of the wafer pedestal 4. The yoke 2 is contoured to the radius of a nominal diameter wafer and is recessed on the underside so that it can engage the chuck registration pins 3 when placed in position on the wafer pedestal 4. The disc 1 also carries a pointer 5 which is pivoted on bearing 6 which is attached to disc 1. The sliding yoke 2 carries a pin 7 which engages a slotted hole in the pointer 5, such that as the sliding yoke 2 moves back and forth, the movable end of the pointer traverses back and forth over scale...