Browse Prior Art Database

Metal Cooling Fins for a Semiconductor Package

IP.com Disclosure Number: IPCOM000047595D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Horvath, JL: AUTHOR [+2]

Abstract

This cooling fin structure can be bonded to a semiconductor package cover of a material with a different coefficient of expansion without the generation of thermally induced stresses. High performance semiconductor package modules require the dissipation of heat generated by the semiconductor devices mounted therein. Cooling fins formed of high thermal conductivity metal are conventionally mounted on the cover to aid in the dissipation of heat. When the cover and heat fins are of different materials with different coefficients of expansion, the temperature fluctuations induce severe stresses in the joint bonding the fins to the cap. Such stresses over time can potentially cause separation of the fins from the cap.

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Metal Cooling Fins for a Semiconductor Package

This cooling fin structure can be bonded to a semiconductor package cover of a material with a different coefficient of expansion without the generation of thermally induced stresses. High performance semiconductor package modules require the dissipation of heat generated by the semiconductor devices mounted therein. Cooling fins formed of high thermal conductivity metal are conventionally mounted on the cover to aid in the dissipation of heat. When the cover and heat fins are of different materials with different coefficients of expansion, the temperature fluctuations induce severe stresses in the joint bonding the fins to the cap. Such stresses over time can potentially cause separation of the fins from the cap. This cooling fin structure consists of a flat metal plate 10, provided with a plurality of rows of parallel overlapping slots 12 and 14, as shown in Fig. 1, that is bent to a serpentine shape, as indicated in Fig. 2. The slotted serpentine cooling fin structure can be bonded to a cap, typically ceramic. The slotted structure separates the bond interface into small areas, thereby distributing the bond areas and allowing each to expand separately. This avoids the collective expansion of a solid fin bond interface.

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