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Method of Continuously Determining the Deposition Rate During Electroless Copper Deposition

IP.com Disclosure Number: IPCOM000047609D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-07
Document File: 2 page(s) / 19K

Publishing Venue

IBM

Related People

Druschke, F: AUTHOR [+4]

Abstract

The proposed method permits the deposition rate of copper from electroless baths to be continuously determined by continuously, quantitatively determining the hydrogen liberated with the copper in equimolecular quantities. The method is based on the fact that during electroless copper deposition, using formaldehyde as a reducer, hydrogen is liberated in equimolecular quantities. (Image Omitted) For practical implementation, a suitably activated copper test coupon with a defined surface is introduced into an externally gas-tight electrolyte cycle of the electroless copper bath. The flow speed of the electrolyte is assumed to correspond to the motion of the bath liquid.

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Method of Continuously Determining the Deposition Rate During Electroless Copper Deposition

The proposed method permits the deposition rate of copper from electroless baths to be continuously determined by continuously, quantitatively determining the hydrogen liberated with the copper in equimolecular quantities. The method is based on the fact that during electroless copper deposition, using formaldehyde as a reducer, hydrogen is liberated in equimolecular quantities.

(Image Omitted)

For practical implementation, a suitably activated copper test coupon with a defined surface is introduced into an externally gas-tight electrolyte cycle of the electroless copper bath. The flow speed of the electrolyte is assumed to correspond to the motion of the bath liquid. The liberated hydrogen is continuously expelled from the electrolyte cycle by an air current and quantitatively determined by one of the usual methods, such as an analytical method, according to the thermal conductivity detected. The recorded value is a measure of the copper deposition rate and can be processed on-line for automatically controlling the dosing of bath components.

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