Browse Prior Art Database

Thermal Enhancement Cap

IP.com Disclosure Number: IPCOM000047712D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Ronkese, BJ: AUTHOR

Abstract

Described is a configuration for cooling ceramic modules. The cold plate 1 has cavities that the ceramic modules 2 fit into, and by the use of thermal grease 3 between the module cap and cold plate, dissipate the unwanted heat, so that the modules operate at a lower temperature. As shown in the figure, a pressed copper cap 4 is attached to the ceramic cap of the module 2 and is designed with a shallow depth, so that the flange 5 of the copper cap rests on the step in the cold plate when the print circuit (P.C.) board is clamped in position. This contact is 360Πand due to the selection and shape of the proper copper or copper alloy, the flange will retain its flexibility and positive pressure. It can be used with or without grease depending on the power dissipation required to satisfy the device reliability.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Thermal Enhancement Cap

Described is a configuration for cooling ceramic modules. The cold plate 1 has cavities that the ceramic modules 2 fit into, and by the use of thermal grease 3 between the module cap and cold plate, dissipate the unwanted heat, so that the modules operate at a lower temperature. As shown in the figure, a pressed copper cap 4 is attached to the ceramic cap of the module 2 and is designed with a shallow depth, so that the flange 5 of the copper cap rests on the step in the cold plate when the print circuit (P.C.) board is clamped in position. This contact is 360OE and due to the selection and shape of the proper copper or copper alloy, the flange will retain its flexibility and positive pressure. It can be used with or without grease depending on the power dissipation required to satisfy the device reliability.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]