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Water-Cooling System for Data Processor With Thick Nickel Coating Over Brazed or Soldered Copper Pipe

IP.com Disclosure Number: IPCOM000047715D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Galyon, G: AUTHOR [+4]

Abstract

A layer of nickel about 5 to 50 mils in thickness is plated over copper pipes that are used in the water-cooling system of a data processor. This layer seals any possible defects in the underlying copper piping or in the brazed or soldered connections. The nickel has good adhesion to the copper; it is mechanically stronger than the copper, and it is galvanically protected by the copper. A large piping assembly is electroplated as a unit without significant masking. The coating has a dull gray appearance that does not require further finishing operations.

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Water-Cooling System for Data Processor With Thick Nickel Coating Over Brazed or Soldered Copper Pipe

A layer of nickel about 5 to 50 mils in thickness is plated over copper pipes that are used in the water-cooling system of a data processor. This layer seals any possible defects in the underlying copper piping or in the brazed or soldered connections. The nickel has good adhesion to the copper; it is mechanically stronger than the copper, and it is galvanically protected by the copper. A large piping assembly is electroplated as a unit without significant masking. The coating has a dull gray appearance that does not require further finishing operations.

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