Browse Prior Art Database

Process for Fabrication of High Resolution Plated Layers

IP.com Disclosure Number: IPCOM000047729D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Barlow, M: AUTHOR [+2]

Abstract

In the fabrication of magnetic thin film heads, the problems that arise when printing a fine pattern in a thick photoresist of varying thickness and levels are solved by the following lithographic process: A plating seed layer, which may be permalloy by way of example, is deposited by sputtering. A thin layer of titanium and then a thick resist are applied. The resist is cured by spin coating, baking and blanket exposure. Another thin titanium layer is deposited on the resist surface, and a thin layer of photoresist is then deposited. The high resolution pattern on the mask is then transferred into the thin layer of the resist by optical exposure and development. The second titanium layer is then patterned by sputter etching.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 95% of the total text.

Page 1 of 1

Process for Fabrication of High Resolution Plated Layers

In the fabrication of magnetic thin film heads, the problems that arise when printing a fine pattern in a thick photoresist of varying thickness and levels are solved by the following lithographic process: A plating seed layer, which may be permalloy by way of example, is deposited by sputtering. A thin layer of titanium and then a thick resist are applied. The resist is cured by spin coating, baking and blanket exposure. Another thin titanium layer is deposited on the resist surface, and a thin layer of photoresist is then deposited. The high resolution pattern on the mask is then transferred into the thin layer of the resist by optical exposure and development. The second titanium layer is then patterned by sputter etching. The underlying photoresist is then dry etched by sputter etching or, alternatively, by ion milling or plasma etching. The original pattern in the thick resist is reproduced with nearly vertical walls. The first titanium layer acts as a very effective etch stop against the etching. The remainder of the second titanium layer and the exposed portions of the first titanium layer are removed with a selective etchant. This leaves a smooth seed layer ready for plating. The desired image, which is identical to the mask, is then plated and the resist removed. Finally, the seed layer is removed by sputter etching. By means of this process, high resolution patterns with near vertical walls are pr...