Browse Prior Art Database

Microstrip Circuit Package Assembly

IP.com Disclosure Number: IPCOM000047809D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 3 page(s) / 65K

Publishing Venue

IBM

Related People

Cistola, AB: AUTHOR

Abstract

A laminated circuit package assembly 1 includes pluggable plural microstrip laminated modules 2 and a mating common microstrip laminated receptacle 3. The advantages of laminated microstrip connectors are described, for example, in U.S. Patent 4,076,357. Controlled collapse chip connections (C4) solder bonds 4 (Fig. 2) are used for the first level connections between the module 2 and its integrated circuit (IC) chip 5. More particularly, the input/output (I/O) pads (not shown), located on the active side of the chip 5 are solder reflow bonded via C4 bonds 4 to the right angle bends (Fig. 2), formed on the resilient cantilever parallel extensions 6 of the planar conductors 7 of module 2. Module 2 has plural dielectric, e.g., polyimide, multi-ply laminates 8 that are interleaved with dielectric spacers S.

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Microstrip Circuit Package Assembly

A laminated circuit package assembly 1 includes pluggable plural microstrip laminated modules 2 and a mating common microstrip laminated receptacle 3. The advantages of laminated microstrip connectors are described, for example, in U.S. Patent 4,076,357. Controlled collapse chip connections (C4) solder bonds 4 (Fig. 2) are used for the first level connections between the module 2 and its integrated circuit (IC) chip 5. More particularly, the input/output (I/O) pads (not shown), located on the active side of the chip 5 are solder reflow bonded via C4 bonds 4 to the right angle bends (Fig. 2), formed on the resilient cantilever parallel extensions 6 of the planar conductors 7 of module 2. Module 2 has plural dielectric, e.g., polyimide, multi-ply laminates 8 that are interleaved with dielectric spacers S. Conformal U-shaped recesses 9 (Fig. 3) are provided in the center portion of the aligned laminates 8 and spacers S to house the chip 5. A strippable organic resilient sealing ring 10 seals the chip 5 in the cavity formed by the aligned recesses 9, allowing the passive side of chip 5 to function as the module cover. The signal conductors 7 (Fig. 3) fan out in a U-shaped pattern to the wider planar conductor members 11 which are in parallel alignment along the legs of the U-shaped laminate 8. In a similar manner, on the opposite side of the laminate 8, correspondingly shaped and aligned members 11 (Fig. 2) are integrally formed from the ground or reference plane of the laminate 8, which plane may be an integral conductive layer 7' or, alternatively, a conductive pattern corresponding to and in aligned registration with the pattern of layer 7 and/or conductive layer 18 of the laminate 8. The members 11 as well as the cantilever extensions 6, are prevented by appropriate masking or the like from adhering to the laminate 8 during the formation process which causes adherence of their associated integral conductors 7, 7' to the laminate 8. Thereafter, the outer plies P of the laminate 8 beneath members 11 are removed, leaving therebetween only the center or core ply 12 extending from the main body of the laminate 8. In a similar manner, all of the plies, i.e., plies P and 12, of the laminate 8 are removed beneath the extensions 6. The tips of the members 11 are then thermal compression bonded or the like to the core ply 12 in the regions
13. Thereafter elongated recesses 14 of sufficient width are cut in the laminate 8 adjacent the bonded regions 13 to sever the bonded regions 13 from the rest of the center ply 12. Next, members 11 are crimped inwardly at C on each side of the ply 12, thereby shaping them into low-insertion-force spring-like bow-shaped slide male contacts on opposite sides of the ply 12. Members 11 are inserted in the direction F (Fig. 2) between their mating wrap-around planar conductor signal and ground female contacts 15 and 16, respectively, of the microstrip laminated receptacle 3...