Browse Prior Art Database

Post Exposed Wafer Preservation

IP.com Disclosure Number: IPCOM000047831D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Henderson, GE: AUTHOR [+2]

Abstract

Wafers that are stored in the ambient (N72ŒF, 30% RH) after exposure show a steady degradation in lithographic performance. Linewidth and development rates for the exposed and unexposed resist are less controllable. However, in a N2 dry box environment (N72ŒF, 0% RH) the control of development can be achieved quite reproducibly for approximately 5 days. The approach here contemplates that immediately after exposure, when development cannot be completed the same day, all resist-coated wafers should be placed in a dry, inert atmosphere and the development of these wafers should be completed within 5 days. If wafers are to be stored in the work area, they should be placed in a closed container that has dry N2 blowing through it constantly.

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Post Exposed Wafer Preservation

Wafers that are stored in the ambient (N72OEF, 30% RH) after exposure show a steady degradation in lithographic performance. Linewidth and development rates for the exposed and unexposed resist are less controllable. However, in a N2 dry box environment (N72OEF, 0% RH) the control of development can be achieved quite reproducibly for approximately 5 days. The approach here contemplates that immediately after exposure, when development cannot be completed the same day, all resist-coated wafers should be placed in a dry, inert atmosphere and the development of these wafers should be completed within 5 days. If wafers are to be stored in the work area, they should be placed in a closed container that has dry N2 blowing through it constantly. However, if wafers are to be transported to and from another area or vendor, they can be placed in an air-tight container, as shown in the drawings.

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