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Attachment of Glass Nozzles to an Adapter Plate

IP.com Disclosure Number: IPCOM000047955D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Bogardus, EH: AUTHOR [+3]

Abstract

The joining of single nozzle or multi-nozzle arrays to an adapter plate requires a corrosion-free resistant bond. The bonding material must also passivate the seal glass that holds the nozzle array together. A potential problem with an existing approach for multi-nozzle arrays is the requirement of extreme flatness and surface finish of its mating parts. In this situation, the adapter plate requires holes and each hole must be bonded to each nozzle. To avoid this problem, it is proposed that a brazing alloy of 80 wt% Au-Sn eutectic which melts at 280ŒC be used. To obtain a corrosion-free alloy, it is necessary to obtain a single Au-rich (97% a) phase, and it must be obtainable at low brazing temperatures, say between 400ŒC or 500ŒC.

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Attachment of Glass Nozzles to an Adapter Plate

The joining of single nozzle or multi-nozzle arrays to an adapter plate requires a corrosion-free resistant bond. The bonding material must also passivate the seal glass that holds the nozzle array together. A potential problem with an existing approach for multi-nozzle arrays is the requirement of extreme flatness and surface finish of its mating parts. In this situation, the adapter plate requires holes and each hole must be bonded to each nozzle. To avoid this problem, it is proposed that a brazing alloy of 80 wt% Au-Sn eutectic which melts at 280OEC be used. To obtain a corrosion-free alloy, it is necessary to obtain a single Au-rich (97% a) phase, and it must be obtainable at low brazing temperatures, say between 400OEC or 500OEC. This is accomplished by reacting a film of the brazing alloy sandwiched between pure Au films having relative thicknesses calculated to give the desired composition. Hafnium is required for adhesion to the glass, and nickel provides a good wetting surface for the alloy. The assembly would be brazed together at 400OEC +/- 100 C in either H2, forming gas or other sufficiently inert atmosphere for a time to be determined by reaction kinetics. The joining of nozzles has been carried out with co-deposited films of the brazing alloy on PYREX* and silicon. These materials were bonded together at 400OEC for l hour in forming gas. Pull tests indicate that the deposited films can withstand 120...