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Barrier Film for Thick Film Dielectric Glasses

IP.com Disclosure Number: IPCOM000047956D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Brownlow, JM: AUTHOR

Abstract

In electronic packaging where thick glass dielectric films are employed, a glassy barrier over substrate metal electrodes will prevent damage due to pin holes. The glassy barrier may be made up, for example, of the oxides of Al, Mg, B, Na, K, Si and Ni and may be spun on or dipped in solutions producing, for example, on a silicon substrate films up to 5000 ˜ with heat to 400ŒC between applications. Solution Components: - The SiO2 derived from soluble organo-silanes. - The B2O3 from H3BO3 dissolved in methanol. - The Al2O3, K2O, NiO and Na2O as nitrates dissolved in alcohol and/or acetic acid. - The MgO as Mg acetate.

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Barrier Film for Thick Film Dielectric Glasses

In electronic packaging where thick glass dielectric films are employed, a glassy barrier over substrate metal electrodes will prevent damage due to pin holes. The glassy barrier may be made up, for example, of the oxides of Al, Mg, B, Na, K, Si and Ni and may be spun on or dipped in solutions producing, for example, on a silicon substrate films up to 5000 ~ with heat to 400OEC between applications. Solution Components: - The SiO2 derived from soluble organo-silanes. - The B2O3 from H3BO3 dissolved in methanol. - The Al2O3, K2O, NiO and Na2O as nitrates dissolved in alcohol and/or acetic acid. - The MgO as Mg acetate.

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