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Dormation of Unsupported Polyimide Films

IP.com Disclosure Number: IPCOM000048024D
Original Publication Date: 1983-Oct-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Gupta, MR: AUTHOR [+3]

Abstract

This method is used for removing thin (1 micron to 1 mil) polyimide films from a supportive substrate, such as silicon wafer, glass, ceramic or metals. The substrate surface should be clean, and can be untreated or rinsed with an alcohol or water, for example, to provide a good wetting surface.

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Dormation of Unsupported Polyimide Films

This method is used for removing thin (1 micron to 1 mil) polyimide films from a supportive substrate, such as silicon wafer, glass, ceramic or metals. The substrate surface should be clean, and can be untreated or rinsed with an alcohol or water, for example, to provide a good wetting surface.

Lift-off is accomplished by immersion in hot/boiling (60- 100OEC) water. The film readily separates after 20-60 minutes (depending on thickness and cure) upon removal from the water bath. The cooling effect induces a thermal shock. If the film-coated substrate remains in water for a longer period, separation might not occur or might require considerably more time.

This technique yields an uncontaminated film free of process chemicals.

Anonymous

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