Browse Prior Art Database

Additive for Palladium Plating Bath

IP.com Disclosure Number: IPCOM000048125D
Original Publication Date: 1981-Dec-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Caricchio, JJ: AUTHOR [+2]

Abstract

A method and composition for plating palladium and nickel is described in U.S. Patent 4,100,039.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

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Additive for Palladium Plating Bath

A method and composition for plating palladium and nickel is described in U.S. Patent 4,100,039.

It has been found that the addition of ten grams per liter of sulfamic acid (H NH(2)SO(3)) to the bath enables one to control and regulate the desired alloy composition. The use of this additive eliminates the need for sensitive "fine tuning" of the primary plating solution constituents. The resulting material exhibits a noticeable improvement in solder wettability when compared to nonadditive palladium nickel plating. The effect which sulfamic acid has on the plating solution can be explained by the apparent ease of ionic dissociation which it has in the solution.

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