Browse Prior Art Database

Spring Loaded Stamp Head

IP.com Disclosure Number: IPCOM000048143D
Original Publication Date: 1981-Dec-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 2 page(s) / 59K

Publishing Venue

IBM

Related People

Hasse, LE: AUTHOR [+2]

Abstract

In one method (Fig.1) of marking elements, such as modules, the marking head pad is supported on a solid block, which requires a precise adjustment of travel (D) to achieve correct stamping pressure without damaging the module or smearing the ink. The time required for this critical adjustment results in longer set-up time impacting tool throughput and yield.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Spring Loaded Stamp Head

In one method (Fig.1) of marking elements, such as modules, the marking head pad is supported on a solid block, which requires a precise adjustment of travel (D) to achieve correct stamping pressure without damaging the module or smearing the ink. The time required for this critical adjustment results in longer set-up time impacting tool throughput and yield.

In the new method described here (Fig 2), the marking head/ pad assembly is a spring-loaded assembly. This head is designed to absorb the shock when the marking pad makes contact with the module. There is no critical adjustment necessary while preventing damage to the module and smearing the ink. The set-up time required for adjustments is reduced, and throughput and yield are increased.

1

Page 2 of 2

2

[This page contains 6 pictures or other non-text objects]