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Browse Prior Art Database

Metal Evaporation Thickness Monitor

IP.com Disclosure Number: IPCOM000048173D
Original Publication Date: 1981-Dec-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 2 page(s) / 61K

Publishing Venue

IBM

Related People

Cosgrove, JF: AUTHOR [+4]

Abstract

Described is a mechanism to obtain individual metal thicknesses in a multiple metal evaporation, without using or processing wafer or other monitor samples.

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Metal Evaporation Thickness Monitor

Described is a mechanism to obtain individual metal thicknesses in a multiple metal evaporation, without using or processing wafer or other monitor samples.

This device is a four-position rotary indexing mechanism using conventional monitor slides to allow direct thickness measurements of individual metal films during a multiple film evaporation. Prior to evaporation, slide holders and quartz monitor discs are spring loaded (items 19 through 22) onto a rotatable plate 10 with nests 90 degree apart. Underneath the rotatable plate is a solid stationary plate 1 with an aperture hole. During evaporation, the metal being evaporated is allowed through the aperture and deposited on the slide directly above.

During the cycle, when the metal changes after reaching the desired thickness, another slide is indexed over the aperture either manually or by a signal from a film thickness controller. The solenoid 24 releases the coil spring 2 loaded plate and allows it to index 90 degree to a clean slide. The just evaporated on slide is now shielded from further deposit. The clean slide now is subject to the next metal or combination of metals being evaporated. This procedure is repeated until the deposition cycle is completed. Upon venting the system, the slides are removed and the deposit across the center of the slide is measured for thickness.

By mounting this device near the product wafers, a close correlation can be made to the actual thi...