Browse Prior Art Database

Vacuum Handler For Diced Wafers

IP.com Disclosure Number: IPCOM000048192D
Original Publication Date: 1981-Dec-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Pelletier, P: AUTHOR

Abstract

At the dicing step, the processed semiconductor wafer is firmly affixed on a mounting block which has generally a circular central portion to which the wafer is bonded by means of an adhesive sheet. After the dicing step has been completed, the diced chips mounted on the adhesive sheet have to be handled for the subsequent steps: cleaning, testing, sorting, etc. It has usually been noticed that the handling may generate chip defects, such as edge chipping, scratches or fractures, caused by bending the adhesive sheet supporting the chips.

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Vacuum Handler For Diced Wafers

At the dicing step, the processed semiconductor wafer is firmly affixed on a mounting block which has generally a circular central portion to which the wafer is bonded by means of an adhesive sheet. After the dicing step has been completed, the diced chips mounted on the adhesive sheet have to be handled for the subsequent steps: cleaning, testing, sorting, etc. It has usually been noticed that the handling may generate chip defects, such as edge chipping, scratches or fractures, caused by bending the adhesive sheet supporting the chips.

The simple suction device represented in the figure allows the pick-up and handling of diced wafers by applying a vacuum to the active surface of chips.

Mechanical defects have been greatly reduced, since there is no longer any manual contact with the adhesive sheet.

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