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Ultra Low Profile Pin Grid Array Socket

IP.com Disclosure Number: IPCOM000048305D
Publication Date: 2005-Feb-08
Document File: 1 page(s) / 7K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a mechanism that lowers the height of a mobile pin grid array package (PGA). The mechanism consists of a socket receptacle for the pins placed on the far side of a motherboard.

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Ultra Low Profile Pin Grid Array Socket

Disclosed is a mechanism that lowers the height of a mobile pin grid array package (PGA). The mechanism consists of a socket receptacle for the pins placed on the far side of a motherboard.

Current sockets use contacts that are surface mounted to the same side of the motherboard as the device being socketed.  This adds the thickness and structure height of the socket to the overall height of the device.  The disclosed mechanism takes the thickness of the socket and places it on the far side of the motherboard.

In-board contacts are produced today for larger pitch PGAs.  The design of the disclosed mechanism allows a smaller hole through the motherboard and keeps the structure of the socket from adding to the hole size.

The disclosed mechanism allows the pins of the PGA to go through holes in the motherboard and engage with a socket receptacle on the far side. This design produces the lowest height possible for this component. This enables a socketed device to have a lower profile than a surface mount device.

The disclosed mechanism will benefit system manufacturers who produce notebook computers, as well as socket manufacturers, and manufacturers of imitator systems. The mechanism will enable the manufacture of low profile notebook systems, satisfying a growing demand for smaller notebooks.