Browse Prior Art Database

Wiring Cage

IP.com Disclosure Number: IPCOM000048324D
Original Publication Date: 1982-Jan-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 2 page(s) / 102K

Publishing Venue

IBM

Related People

Rees, WK: AUTHOR

Abstract

It is often necessary to adapt wire bond configured chips for mounting onto substrates which are configured for flip-chip bonding. One way of adapting such wire bond configured chips for such mounting is by the use of a JEDEC (Joint Electron Device Engineering Council) chip carrier. The present technique provides a mounting for the JEDEC chip carrier which allows it to be attached directly to a flip-chip configured substrate without the need for any intermediate packaging layer.

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Wiring Cage

It is often necessary to adapt wire bond configured chips for mounting onto substrates which are configured for flip-chip bonding. One way of adapting such wire bond configured chips for such mounting is by the use of a JEDEC (Joint Electron Device Engineering Council) chip carrier. The present technique provides a mounting for the JEDEC chip carrier which allows it to be attached directly to a flip-chip configured substrate without the need for any intermediate packaging layer.

Figs. 1 and 2 show the initial and final steps in manufacturing the mounting device and the final attachment of the device to the JEDEC chip carrier and a metallized ceramic substrate.

As shown in Fig. 1, a rectangular metal sheet is provided and the sheet is stamped to form a plurality of legs 10, connected at their outer periphery by an outer commoning bar 12, and at their inner periphery by an inner commoning bar
14. The legs 10 are ultimately to be used as connecting legs between the JEDEC chip carrier and the ceramic substrate.

Next, a plastic ring 16 (Fig. 2) is moulded, interconnecting the legs 10. The plastic ring 16 serves to hold the legs 10 in place, after which the commoning bars 12 and 14 are removed. The mounting device is thus comprised of a plurality of circumferentially spaced, radially extending legs 10 maintained in place by a plastic ring 16.

The mounting of a JEDEC type carrier 18 is shown in Fig. 2. The JEDEC carrier 18 has a plurality of castellations 20...