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Diglyme/ Cyclohexanone Casting Solvent for Resists

IP.com Disclosure Number: IPCOM000048346D
Original Publication Date: 1982-Jan-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hayden, TH: AUTHOR [+2]

Abstract

This resist enhances the dewet characteristics of the resist, increases the solubility of the photoactive compound (PAC), and reduces the amount of total solids in the resist solution.

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Diglyme/ Cyclohexanone Casting Solvent for Resists

This resist enhances the dewet characteristics of the resist, increases the solubility of the photoactive compound (PAC), and reduces the amount of total solids in the resist solution.

Described here is a new casting solvent for resists, which comprises a 50/50 wt/wt% mixture of cyclohexanone and diglyme. This solvent system has the following advantages over the present solvent, diglyme: (a) the dewet characteristics are improved; (b) the solubility of the PAC is higher so that it is possible to formulate the resist with higher PAC content, pure PACs are soluble, and the rate at which resin and PAC dissolve during formulation is increased; (c) the same resist film thickness can be obtained from resist solutions which contain lower total solid percentage than conventional formulation, thereby reducing PAC and resin requirements.

Tentative results indicate that resists formulated with this casting solvent perform equal to or better than the conventional formulation with respect to the formation of striations in the resist and performance in a functional test which measures the retio of development rates for exposed to unexposed resist at 10 micrometers per sq Coul.

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