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Multi-Turn Core and Winding For Thin Film Inductive Head

IP.com Disclosure Number: IPCOM000048458D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Chow, WW: AUTHOR

Abstract

An increased effective number of turns is obtained through the multiplication of core and winding turns. A multi-turn winding is wrapped around a multi-turn core for an effective multiplication of the turns. Besides the conservation of surface area, this design leads to simplified processing and lower electrical resistance in the coil.

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Multi-Turn Core and Winding For Thin Film Inductive Head

An increased effective number of turns is obtained through the multiplication of core and winding turns. A multi-turn winding is wrapped around a multi-turn core for an effective multiplication of the turns. Besides the conservation of surface area, this design leads to simplified processing and lower electrical resistance in the coil.

In the figure, a multi-turn core 10 together with the multi-turn winding 11 are shown deposited onto a wafer substrate 12. Generally, in thin film inductive heads, the surface available for the film deposition is limited. Using a multi-turn core 10 with a multi-turn winding 11 can produce a multiplication, to arrive at an effective number of turns. Magnetic insulation 13 separates one pole tip 14 from the remaining turns of the core 10. Pole tip 14 together with pole tip 15 form a magnetic gap 16. The offset 17 in the pole tip 14 can be eliminated with the pole tip 14 being placed alongside of the pole tip 15 such that the magnetic gap is formed perpendicular to the plane of the thin film. Contact pads 18 connect the windings 11 to the channel circuitry.

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