Browse Prior Art Database

Bus For Breadboards

IP.com Disclosure Number: IPCOM000048465D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 2 page(s) / 72K

Publishing Venue

IBM

Related People

Schappert, MA: AUTHOR

Abstract

The number of wires that have to be put on top of a circuit breadboard for buses may be reduced by using a number of layers of a conducting material that would be insulated from one another. This multilayer system would be placed under the existing circuit breadboards with holes that match up with the boards, as illustrated in Fig. 1. The different layers are connected with the original board with pins that are of a specific length for a specific layer, as illustrated in Fig. 2.

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Bus For Breadboards

The number of wires that have to be put on top of a circuit breadboard for buses may be reduced by using a number of layers of a conducting material that would be insulated from one another. This multilayer system would be placed under the existing circuit breadboards with holes that match up with the boards, as illustrated in Fig. 1. The different layers are connected with the original board with pins that are of a specific length for a specific layer, as illustrated in Fig. 2.

There are two ways to implement the pin-to-bus connection:
1. The pin can be constructed like s banana plug with spring

leaves fitting into a round hole, as illustrated in Fig. 3.
2. The pin can be a straight shaft with a conducting material at

the proper height fitting into a slit that is slightly

undersized or otherwise formed to be resilient, as illustrated

in Fig. 4.

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