Browse Prior Art Database

Simultaneous Chip Placement - Multi-Chip Modules

IP.com Disclosure Number: IPCOM000048545D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 2 page(s) / 65K

Publishing Venue

IBM

Related People

Audi, RD: AUTHOR

Abstract

In the evolution of packaging of semiconductor chips, it is becoming increasingly more common to mount a plurality of chips on a single substrate. This mounting requires precise positioning of each of the chips so that their solder ball connections are properly aligned with the pads on the substrate to which they are to be joined.

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Simultaneous Chip Placement - Multi-Chip Modules

In the evolution of packaging of semiconductor chips, it is becoming increasingly more common to mount a plurality of chips on a single substrate. This mounting requires precise positioning of each of the chips so that their solder ball connections are properly aligned with the pads on the substrate to which they are to be joined.

In order to align the chips properly, a template is provided, as shown in Figs. 1 and 2, which will properly align the chips, and a chip-mounting device is provided, as shown in Figs. 3 and 4, which will properly position the templates and remove the chips therefrom and place them on a substrate.

As shown in Figs. 1 and 2, a chip-holding template 10 is provided. The template 10 is formed of a flat piece of material which has a plurality of chip receiving cavities 12 formed therein. The cavities are in gross alignment with the desired chip position, and each cavity is shaped to receive a specific chip. Formed in the cavities 12 are through apertures 14 which correspond to the solder ball connections 16 of chips 18. These apertures are precisely aligned with respect to each other and the apertures in other cavities to precisely align each of the chips 18 with respect to each other.

The templates 10 are mounted in a placement device shown in Figs. 3 and 4. As can be seen in these figures, two templates 10 are mounted at the end of mounting arms 20 which in turn are secured to a central hub 2...