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Thermal Stability Enhancement of Solution-Deposited Aminosilanes

IP.com Disclosure Number: IPCOM000048576D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Anderson, HR: AUTHOR [+4]

Abstract

Solution-deposited silanes (e.g., amino) are commonly used to promote the adhesion of polymeric coatings (insulators) to a variety of metal and oxide substrates, as, for example, encountered with semiconductor devices. However, when these silanes are used in conjunction with high temperature polymers, then these adhesion promoters should also be able to withstand the required temperature. One application of high temperature adhesion promoters is in the area of the top surface metallurgy in the semiconductor art.

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Thermal Stability Enhancement of Solution-Deposited Aminosilanes

Solution-deposited silanes (e.g., amino) are commonly used to promote the adhesion of polymeric coatings (insulators) to a variety of metal and oxide substrates, as, for example, encountered with semiconductor devices. However, when these silanes are used in conjunction with high temperature polymers, then these adhesion promoters should also be able to withstand the required temperature. One application of high temperature adhesion promoters is in the area of the top surface metallurgy in the semiconductor art.

The solution-deposited silanes are not very good from a thermal stability standpoint, and thus can be remedied by the use of antioxidants in combination with silane. The co-deposited (co-condensed) layer formed should not only be a good adhesion promoter but should also possess enhanced thermal stability. The antioxidant could be selected with the proper moiety (e.g., -NH(2)) so that it can take part in the condensation of the deposited silane layer (e.g., aminosilane).

This approach offers a number of advantages. The adhesion promoters have enhanced thermal stability. The deposited layers should be less brittle as the antioxidant should act as a plasticizer. This is desirable to take care of the stresses created due to thermal mismatch.

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