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Stress Relieved And Low Thermal Resistance Structure For Cooling Solder Bonded Semiconductor Devices

IP.com Disclosure Number: IPCOM000048607D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Oktay, S: AUTHOR [+2]

Abstract

This structure enables high chip power dissipating capability to be achieved in a non-hermetic air environment with minimum stress applied to a device. This advantage is achieved by using a bellows structure for conducting heat from a semiconductor device to a cold plate.

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Stress Relieved And Low Thermal Resistance Structure For Cooling Solder Bonded Semiconductor Devices

This structure enables high chip power dissipating capability to be achieved in a non-hermetic air environment with minimum stress applied to a device. This advantage is achieved by using a bellows structure for conducting heat from a semiconductor device to a cold plate.

In order to achieve very high rates of heat transfer from the heat source, i.e., the semiconductor device, to the heat sink, thermal resistance from the device to the heat sink must be very small. This calls for a metallic connection to bridge the air gap between the device and the heat sink, with the very important criteria that it be short and stubby to provide a good heat path and at the same time be flexible enough so as not to constrain excessively the chip movement caused by differential expansion of the module components during the operation in the field.

In this structure, a bellows 10 of the type illustrated in Fig. 1 is used to conduct heat from the semiconductor device to the heat sink. Bellows 10 has a shoulder 12 that is dressed with solder 14, a plurality of convolutions 16, and a lower flat surface 18 provided with a solder dressing 20. Fig. 2 is an illustration showing bellows 10 bridging the gap between semiconductor devices 22. mounted on substrate 24, and cold plate 26. Cold plate 26 has bores 28 located over devices 22 that receive the shoulder portions 12 of the bellows 10. T...