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Semiconductor Chip Cooling System With Temperature Regulation

IP.com Disclosure Number: IPCOM000048619D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Brunsch, A: AUTHOR [+3]

Abstract

This cooling system comprises a liquid-cooled module with multilayer ceramic substrate 1 to which chips 2 to be cooled are soldered. Module cap 3, 4 and cooling liquid introduced in gap 5 between module cap 3, 4 and module cover 6 serve as a heat sink. Thermal contact between the surfaces of chips 2 and module cap 3, 4 is established by a thin foil 7 of rubber or plastic compounds and metal powder.

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Semiconductor Chip Cooling System With Temperature Regulation

This cooling system comprises a liquid-cooled module with multilayer ceramic substrate 1 to which chips 2 to be cooled are soldered. Module cap 3, 4 and cooling liquid introduced in gap 5 between module cap 3, 4 and module cover 6 serve as a heat sink. Thermal contact between the surfaces of chips 2 and module cap 3, 4 is established by a thin foil 7 of rubber or plastic compounds and metal powder.

If the electric load fluctuates, the temperature of chips 2 generally fluctuates too, over a wide range. In the case of the system shown in Figs. 1 and 2, this temperature range is considerably limited, thus reducing the functional requirements of the circuits integrated on chips 2.

It has been found that the thermal conductivity of a metal-filled foil perpendicular to the foil plane is heavily influenced by the pressure exerted on the foil. This permits regulating the temperature of chips 2 by increasing the pressure at which foil 7 is forced between module cap 3, 4 and chip 2 when the chip temperature rises.

A temperature measuring pint, for example, in the form of a thermal resistor or a thermocouple 8, is provided on chip 2. The measuring signal emitted is used to regulate the pressure of the cooling liquid by which module cap 3, 4 is cooled with the aid of a conventional controlled system.

In Fig. 1, module cap 3 is a thin membrane so that the pressure of the cooling liquid is uniformly distributed on c...